Intel® Centrino® Processor Technology
with New Intel® Core™2 Duo Processor
More performance. More freedom. More bandwidth.
• CPU performance for high-def movies and music:
Enjoy the performance of the Intel® Centrino® processor
technology – it provides the computing power for a great
high-def experience and you can enjoy the rich sound
quality of your music, movies and gaming with Intel® High
Definition Audio.
• Innovate with amazing multimedia performance: Now
you can get up to 50% more performance on intensive
multimedia like HD video encoding with Intel® HD Boost.1
• Designed for the longest possible battery life5: Unique
new power management and power saving features help
extend battery life so you can enjoy more entertainment,
gaming, and music while on the go. Stay unplugged longer.
Reinventing Performance, Redefining Efficiency.
Intel Centrino processor technology featuring the new Intel® Core™2 Duo processor enables outstanding
mobile dual-core performance while enabling improved battery life and enhanced wireless connectivity —
all in a variety of laptop designs so you can choose the right one for you, your family or your business.
• Use less, do more: New T8000Δ and T9000Δ series
CPUs are lead-free and have unique power-saving
features like Intel® Deep Power Down for conserving
energy and protecting the environment.
• Faster, broader, better: Now up to 5X faster wireless
performance and up to 2X greater range than 802.11
a/g solutions with an Intel Centrino processor technologybased
notebook with optional Intel® Next-Gen Wireless-N
and a wireless-N home network.2
• Need for speed?: Look for Vista*-based notebooks with
new Intel® Turbo Memory for up to 2X faster performance
when loading frequently used, memory-intensive applications3
and better boot time.4
CORE 1 CORE 2
Intel® Advanced
Smart Cache
BUS
Intel® Centrino® processor technology
• New 45nm Intel® Core™ Duo processor
• Mobile Intel® 965 Express Chipset Family
• Intel® Next-Gen Wireless-N (Intel® Wireless WiFi Link 4965AGN)
or Intel® PRO/Wireless 3945ABG Network Connection
• Intel® Turbo Memory (Optional)
Feature Benefit
Intel® Core™2 Duo Processor
Intel® 45nm high-k (Hi-k) metal gate silicon technology is the nextgeneration
Intel® Core™ microarchitecture. With roughly twice the
density of Intel® 65nm technology, Intel’s 45nm packs more transistors
into the same silicon space.
Improved performance and responsiveness to run multiple demanding
applications simultaneously with unique new power-saving features,
enabling great battery life.5
Larger Intel® Advanced Smart Cache
Intel® Advanced Smart Cache is now even larger – up to 6 MB, so more
data can be kept near the processing cores. Intel’s unique shared L2
cache allows both cores access to the full L2 memory area, and allows
shared data to be accessed from cache, minimizing bus traffic. It also
allows one core to use the entire cache when the other core is inactive.
This design provides twice the bandwidth to L1 cache compared to the
previous-generation Intel® Core™ Duo processor.
Larger, smarter and more efficient cache design enables better performance,
responsiveness, and power savings.
Intel® HD Boost
47 new multi-media instructions and a faster Super Shuffle Engine
that processes all streaming SIMD extensions faster.
Doubles the rate at which streaming media instructions can be executed.
Great for multimedia applications, such as video editing, digital photography,
and gaming. Allows up to 50% greater performance on HD Video Encoding.1
Lead-Free
Materials in Intel® 45nm technology are now 100 percent lead-free. Reduced lead’s potential impact to the environment and public health.
Intel® Deep Power Down Technology
Intel® Deep Power Down Technology is a new low-power state that
allows both cores and L2 cache to be powered down when the
processor is idle.
The power to use less and do more – Intel’s unique power-saving features
enable longer battery life so you can stay unplugged longer and help the
environment by conserving natural resources.5
Intel® Dynamic Power Coordination
Helps manage voltage and power consumption. One core can demand
high performance while the other core can independently transition
to a low-power state.
Enables reduction in power consumption and enables improved battery life.5
Mobile Intel® GM965 Express Chipset featuring Mobile Intel® Graphics Media Accelerator X3100 (Optional)
Next-generation graphics include software enhancements
enabling DirectX*10,6 Hardware Transform and Lighting, and
Vertex Shader Model 3.0
Enables greater visual detail, realism and an enhanced overall gaming
experience. Also supports compatibility for more gaming titles and greater
gaming content. Display settings and power management features minimize
power consumption, enabling improved battery life. Up to 2X performance
on graphics applications as measured by 3DMark*06 versus previous
graphics engine.7
Intel® Clear Video Technology
Video technology delivering enhanced video quality. Provides outstanding video playback with sharper image quality,
increased clarity, and customizable color controls.
Enhanced Support for a high-definition experience
HD DVD* and Blu-ray* logo support now enabled with integrated
graphics (via a third-party decoder). Support for digital interface
with integrated audio and HDCP content protection.8 Enhanced
hardware acceleration for MPEG2 and WMV9B* playback.
Intel helps bring high-definition to mainstream — HD DVD* and Blu-ray* logo
support now enabled with integrated graphics. Enhanced HD experience
with improved HDTV connectivity and HDMI supporting up to 1080p and
easy-to-use TV configuration utility, Intel® TV Wizard.
Intel’s Best Technologies for Notebooks
Feature Benefit
Intel® PRO/Wireless 3945ABG Network Connection
Connects to most available industry-standards-based wireless LAN
(802.11b, 802.11a, and 802.11g) infrastructures.
Flexibility to connect to your wireless home network and public wireless
LAN hotspots located in airports, hotels, restaurants, and coffee shops
around the world.10
Intel® Next-Gen Wireless-N (Intel® Wireless WiFi Link 4965AGN) (Optional)
Up to 5X faster compared to 802.11a/g products with data rates up
to 300 Mbps.2 Support for legacy and latest high throughput WLAN
technologies provides connectivity options for multiple environments.
Helps overcome network capacity issues, allowing increased simultaneous
network activity for large file transfers, streaming HD video, multi-player
gaming, VOIP and more.
Up to 2X2 greater range with MIMO and antenna diversity support
MIMO technology leverages multipath behavior by using multiple,
“smart” transmitters and receivers with an added “spatial” dimension
to increase performance and range.
Reduces the number of “dead zones,” dropped data packets, network
re-connects, and dramatically improves connectivity throughout the home.
“Connect with Intel® Centrino®” Identifier
Intel has certified access points from leading vendors, through extensive
compatibility and real-world performance testing, to help ensure
high throughput and seamless connectivity in Draft-N9 mode.
Connect with confidence with a large selection of WLAN AP/router
products that enable a great Draft-N9 experience for Intel® Centrino®
processor technology customers.
Great battery life5 with optimized power modes
Reduced WLAN power consumption can help deliver great battery life.5 Allows for greater utility, enjoyment, and convenience.
Intel® Turbo Memory (Optional)
Flash Memory Technology supporting both Windows Vista* ReadyDrive
and ReadyBoost functions for read and write information chaching.
Stores large amounts of frequently used information close to the
processor to reduce system bottlenecks.
Look for Vista*-based notebooks with new Intel® Turbo Memory for
up to 2X faster performance when loading frequently used, memoryintensive
applications3 and better boot time.4
Discover more about Intel Centrino processor technology with the Intel Core 2 Duo
processor now at intel.com/products/centrino/centrino/index.htm
Find out how you can create custom notebooks for custom performance needs
at intel.com/go/channelnotebooks
Δ Intel processor numbers are not a measure of performance. Processor numbers differentiate features within each processor family, not across different processor families. See www.intel.com/products/processor_number
for details.
1 Performance measured based on TMPGEncoder* Xpress* 4.4 optimized for Intel® HD Boost, comparing latest generation pre-production Intel® Core™ Duo Processor T9500 & T8100 with a comparable frequency
previous generation Intel® Core™ Duo Processor. Actual performance may vary. See http://www.intel.com/performance/mobile/benchmarks.htm for important additional information.
2 Up to 2x greater range and up to 5x better performance with optional Intel® Next-Gen Wireless N technology enabled by 2x3 Draft N implementations with 2 spatial streams. Actual results may vary based on your specific
hardware, connection rate, site conditions, and software configurations. See http://www.intel.com/performance/mobile/wireless/index.htm for more information. Also requires a Connect with Intel® Centrino® processor
technology certified wireless n access point. Wireless n access points without the Connect with Intel Centrino processor technology identifier may require additional firmware for increased performance results. Check
with your PC and access point manufacturer for details.
3 Tests run on latest generation Intel® Centrino® processor technology with optional Intel® Turbo Memory enabled against like systems without Intel® Turbo Memory running Google* Earth and Adobe Photoshop* Elements
5.0. Results may vary based on hardware, software and overall system configuration. All tests and ratings reflect the approximate performance of Intel products as measured by those tests. All testing was done on
Microsoft Vista* Ultimate (build 6000). Application load and runtime acceleration depend on Vista*’s preference to pre-load those applications into the Microsoft ReadyBoost* cache. See http://www.intel.com/performance/
mobile/Intel_Turbo_Memory.htm for more information.
4 Tests run on latest generation Intel® Centrino® processor technology with optional Intel® Turbo Memory enabled against like systems without Intel® Turbo Memory. Results may vary based on hardware, software and overall
system configuration. All tests and ratings reflect the approximate performance of Intel products as measured by those tests. All testing was done on Microsoft Vista* Ultimate (build 6000). Application load and runtime
acceleration depend on Vista*’s preference to pre-load those applications into the Microsoft ReadyBoost* cache. Boot-time performance depends on BIOS and POST execution times as well as hard drive performance.
Power savings will depend upon the system power management settings as well as the specific hard drive used. See http://www.intel.com/performance/mobile/Intel_Turbo_Memory.htm for more information.
5 System performance, battery life, power savings, high-definition quality, video playback and functionality, and wireless performance and functionality will vary depending on your specific operating system, hardware, chipset,
connection rate, site conditions, and software configurations. References to enhanced performance refer to comparisons with previous generation Intel technologies. See http://www.intel.com/products/centrino/index.htm and
http://www.intel.com/performance/mobile/benchmarks.htm for more information on performance, power savings and energy efficiency.
6 DirectX* 10 feature not available at product launch. Expected availability is March 2008 and will be available as a software download via intel.com.
7 As measured by 3DMark*06 comparing latest generation Intel® Centrino® processor technology-based notebooks including Intel integrated graphics with previous generations of Intel Centrino processor technology. Actual
performance may vary. See http://www.intel.com/performance/mobile/benchmarks.htm for important additional information.
8 Some features and security solutions may not be supported by your PC’s operating system and may require additional software and/or certain hardware as well as wireless LAN infrastructure support. Check with your PC
manufacturer for details.
9 “Draft-N” refers to: IEEE P802.11n*/D1.0 Draft Amendment to STANDARD [FOR] Information Technology-Telecommunications and information exchange between systems-Local and Metropolitan networks-Specific requirements-
Part 11: Wireless LAN Medium Access Control (MAC) and Physical Layer (PHY) specifications: Enhancements for Higher Throughput.
10 Wireless functionality may vary by country and some hotspots may not support Linux-based Intel® Centrino® processor technology systems.

Secret of ultra-hard graphite unlocked

THE prospect of making materials so hard they can dent diamond has come a step closer with insight into the structure of a new form of superhard graphite.

In 2003, an experiment suggested that graphite, which is normally soft, could become ultra-hard when compressed. Graphite squeezed between two diamond jaws at pressures of 170,000 atmospheres managed to produce a crack in the diamond. The atomic structure of the material remained elusive, however.

Graphite at 170,000 atmospheres managed to crack diamond, but its structure was elusive

Now computer simulations by Hui-Tian Wang at Nankai University in Tianjin, China, and colleagues have shown that the compressed material could be at least partly made of bct-carbon, which is built up from rings of four carbon atoms. Bct-carbon has attributes of both diamond, which has a cubic structure, and graphite, composed of loosely linked sheets of carbon atoms in a hexagonal lattice. In bct-carbon, layers of carbon rings are linked by strong vertical bonds.

The team modelled various crystal structures that could result when graphite is compressed, and found that bct-carbon requires the least energy to form .

Wang's team reckons that bct-carbon's shear strength - a measure of how difficult it is to slide the carbon layers over one another - is 17 per cent greater than that of diamond. Their findings raise the prospect of making exceptionally hard materials without extreme heating. Most other materials we suspect to be harder than diamond require both high temperature and pressure to form.

Artem Oganov at the State University of New York in Stony Brook says that, compared with other candidates, there is "a much stronger basis" for bct-carbon to be harder than diamond, but adds that experiments are still needed to test the claims.

Intel's 2011 CPUs require new motherboards, start saving those pennies now?

Hoping Intel's 32nm Sandy Bridge CPUs will unify your computing world next year? Bit-tech reports they may also drain your pocketbook. Anonymous sources told the site that Intel's spiffy new CPU / GPU / memory controller integrations will use two new sockets, LGA-1155 and LGA-2011; if true, you'll need to buy a new motherboard to match. Aside from packaging the aforementioned GPU and memory controller on the same die, LGA-1155 rumors don't hold any surprises thus far, but the enthusiast-grade LGA-2011 chips will supposedly sport a quad-channel DDR3 memory controller (like Nehalem EX) and the long-awaited PCI Express 3.0 for 32 lanes of graphics-gobbling bandwidth. We also hear new southbridges will have native SATA 6G. Honestly, these rumors are so tame as to be entirely credible. Let's dream up something ridiculous, like Intel actually supporting USB 3.0



Created By Shem